Temperature Curing Non-Drip Epoxy

Polymer Adhesive EP21ND is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or elevated temperatures with a one-to-one mix ratio, weight or volume. It develops a high bonding strength of more than 3000 psi at room temperature, and is insensitive to mixing ratio or substrate cleaning procedures.

The epoxy is designed to be applied without sagging or dripping on vertical services, and the bonds produced are resistant to thermal cycling and chemicals such as water, oil and organic solvents over a temperature range of –60°F to more than +250°F. The epoxy bonds to metals, glass, ceramics, wood, vulcanized rubbers, and plastics, and is an electrical insulator. It is engineered to be used in electronic, electrical, computer, construction, metalworking, appliance, automotive, and chemical industries.

Master Bond, Inc., 154 Hobart St., Hackensack, NJ 07601. Tel: 201-343-8983; Fax: 201-343-2132.